HIGHER COMPUTE POWER​

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As the demand for more compute power grows in users' daily lives, we explored what that might look like in mobile devices.

 

There are many challenges when placing powerful computing power in smaller hand-held form factors. Thermally, the device needs to dissipate the heat generated for a comfortable hold.

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INNOVATIVE EXPLORATION

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​Instead of minimizing the space needed for heat dissipation, I allowed the entirety of the main housing to be used as a heat sync. This allowed for more effective cooling and maximized compute power. The protective co-molded silicone outer housing acts as a barrier to human contact, as the clean linear grooves allow for passive air cooling. Not only does the outer housing act as a protective layer but it enhances hold and creates a better tangible experience.